Camera Expands Field of View
The modular Ensenso X 3D camera system with high-resolution 5 MP industrial cameras features the IMX264 CMOS
Sony sensor. Compared to the 1. 3 MP sensors, they allow for an expanded feld of view, higher resolution, and lower
noise levels. The models of the 3D camera family are easy to set up and operate via the EnsensoSDK. The Ensenso
X 3D camera system consists of a powerful 100 watt projector, to which two industrial cameras can be mounted at
variable distances. Applications range from factory automation to warehouse and logistics automation.
IDS Imaging Development Systems Inc.
Flow Valves for Demanding Tasks
The PVG portfolio has expanded to include the
PVG 128 and PVG 256 valves that are designed
to easily integrate with the existing line of Danfoss high performance proportional valves—PVG
16 and PVG 32—allowing modularity from low to
high hydraulic fow within the same valve stack.
Danfoss Power Solutions
Teledyne LeCroy WaveSurfer has designed a 3000z
4-channel Oscilloscope range, offering 100 MHz - 1
GHz bandwidth, capacitive touch capabilities, huge
memory, and a comprehensive tool box in a compact,
small footprint product. Featuring an advanced user-in-terface—MAUI—the scopes all have 20 Mpts of memory.
Saelig Company, Inc.
Non-Contact Laser Monitoring
Ophir Beam Watch, a non-contact beam monitoring system for very high power lasers,
provides real-time beam measurements of lasers that are typically too powerful for direct
readings. The initial determination of focal spot size, beam waist location, divergence
angles, and beam propagation ratios (M2) are easily and almost instantly obtained.
MKS Instruments, Inc.
Outlets Provide Cost-Savings for PDUs
Styles F and J family of
appliance outlets per
IEC 60320-1, are available with integrated light
pipe. The light pipe indicates operational status, or other function
status, as an optional
feature to standard connectors. It is designed to
channel light from LEDs
on the pc board to the front of the connector. The technology offers fexible design options including up to 4 light pipes, enabling
increased opportunity to signal status information from the power
grid to the user.
Digitally Connected Filling Machine
production can take place under low-oxygen conditions
The SVP250 LF processing system is designed
for injection solutions with small batches ranging
from 15 to 250 liters. The system includes both a
preparation and a storage vessel. Depending on
the desired volume, these process vessels can be
expanded to four each, in a range of different sizes.
The preconfgured architecture allows processing
modules to be easily and fexibly installed or exchanged. Since the process vessels are equipped
with a gassing module for nitrogen, production
can also take place under low-oxygen conditions.
The system features a module for two-stage
sterile fltration for aseptic preparation, which is
situated between the preparation vessel and storage vessel. Data on the machine status or process
parameters from both systems can be recorded,
stored and visualized, which leads to improved
transparency in production and shorter response
times. The primary goals are optimal production
planning and maximum capacity utilization.
Bosch Packaging Technology