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is useful for space restrictive areas
A custom-designed bi-directional AGV, theCA-B50100 model, holds body closure panels for an automotive body shop assemblyoperation. This system that replaces forkliftshas bolt-on drive for movement along its embedded magnetic strip guidepath and cantravel laterally or rotate in place. It can travelat speeds up to 164 ft/min. (50 m/min.) andhas an estimated towing capacity of 2,222lb. ( 1,000 kg).
Low Self-Heating Chip Resistor
may be placed closer to heat sensitive components
Making circuit design easier, the RHC2512 2W PowerThick Film Chip Resistor will typically operate 15 to20-deg. cooler than comparable chip resistors. Thehigh-power performance is ideal for a wide rangeof control and power applications, thermostats,safety systems, computers, memory solutions, automation and controls, and industrial equipment.Lower self-heating is due to the materials, design,and processing.
Localized Heat Source Controller
comes with a rugged case with wheels
The ACR3 Hot Bonder controls localized heatsources for a wide variety of manufacturing andcomposite repair applications such as debulkand cure resins, prepregs, adhesives, fibers,and more. The bonder comes complete witha full-color HD touch-screen interfacefor easy programming and graphicdisplay, output cords to match anycompetitors’ blankets, a dual vacuumsystem, and a 30-Amp load capacity.
The OptoTEC OTX/HTX Series ofminiature thermoelectric coolers is designed for high-tem-perature environments foundin telecom, industrial, autonomous, and photonics applications. The cooling devicesare specifically designed tooffer high efficiency and controlthe temperature of heat-sensitive op-toelectronic components used in laser diodes, opticaltransceivers, LiDAR, CMOS, and infrared range sensor applications.
Laird Thermal Systems
Aggregation Unit for
features a tool-free format change
The TQS-CP Aggregation Unitprovides exacting yet expedientsemi-automatic aggregation ofmanually repacked folding boxes.The unit allows manufacturers toconveniently assign units from alower level—such as a folding box orbundle—to a higher one like a shipment carton. In doing so, it providesa reliable parent-child relationshipthat will soon be mandated by pending DSCSA regulations.
Curing at temperatures of around 250to 300°F (125 to 150°C), the EP3HTS-TCNASA Low Outgassing Silver FilledEpoxy has an unlimited working life atroom temperature. The material featuresa thixotropic paste consistency and is notpre-mixed and frozen. It’s well suited forautomatic dispensing equipment or manual syringes and can be applied withoutany tailing.
Master Bond Inc.